haring, Tech nical knowledgeThe A&D group represents a large number of subscribers but their contribution rate measured against authored articles in ElectronicsCooling is underrepresented. Soliciting targeted articles from my coworkers within this industry group has proved difficult. I understand some of the reasons for the lower number of submissions but contend that there are benefits to be gained by finding ways to overcome the barriers that inhibit submissions. Some of the responses to the last question on the survey (What would you like to see in ElectronicsCooling?) made note of desiring more information from A&D.
Other than perhaps a few more restricted technologies, the A&D thermal engineers are not much different from their commercial counterparts. The distinction between commercial and defense electronic components has largely blurred because the commercial industry usually has the desirable state of the art performance. The operating environments are different, however, resulting in a continuing need for thermal design engineers and innovative electronics packaging solutions. Cooling of electronics involves moving annoying waste heat to a location where it is less annoying and one method of moving the heat is with liquid cooling. This form of thermal management is more common in A&D and provides a great opportunity for giving back. As liquid cooling becomes more common in the commercial world, sharing information between the commercial and A&D communities will help the market develop common (and more affordable) liquid cooling products.
While some of the criticism in this column was more focused towards A&D thermal engineers, the benefits of giving back apply to all of us. During this winter season of reflection and generosity, my desire is that these traits would apply not only to our personal lives but to our professional lives as well. I encourage all of our readers to look for opportunities to share their knowledge. As thermal engineers, we have much in common, and my challenge is that giving back will become an even more common description.
