Researchers at the Tyndall National Institute at University College Cork in Ireland have found a new way of cooling semiconductors in computers, mobiles and games consoles to improve their performance and reduce energy consumption.
Most computers have thermal interface materials (TIM) to join the chip with the heat sink, with solder or a thin, film-like sheet. Solder is expensive, and film-based TIMs are easier to work with but far less effective than solder, said Dr. Kafil M. Razeeb of the Tyndal Institute.
Dr. Razeeb and his colleagues have focused their research on developing a new film-based solution, saying the group “successfully fabricated nanowire-based TIM that is at least 50 per cent better in terms of thermal performance than commercial thermal pads”.
Read more from the Irish Times.
