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Reinforced TIM Integrates Nylon Mesh Layer

Heat Sinks, Materials, Compounds, Adhesives, Substrates, New Products, Semiconductor , ,

Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations.

When placed between a heat source such as a high-performance semiconductor and a nearby heat sink, Sarcon 100GR-FL will transfer heat with a thermal conductivity of 2.8W/m-K and a thermal resistance of .67°Cin2/W at 14.5 PSI. This 1.0mm thick, flame retardant thermal interface material (TIM) is available in sheets up to 300 × 200mm.

Fujipoly America Corporation, is a wholly owned subsidiary of Fuji Polymer Industries Co., Ltd. of Japan. Fujipoly America specializes in the fabrication of silicone rubber technology.

Learn more from Fujipoly.

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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