Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS resources provides thermal measurement and modeling capability for IC, diode, transistor, LED, and PV devices and related packaging alternatives. These capabilities extend to heat sink and interface materials, cooling channel design, heat movers such as vapor chambers and heat pipes and optimization of thermal management for 3D packaging and stacked chips.
Thermal Company Partners With Packaging Services Firm
