May 23-24, Palaiseau, France
The European Commission ICT theme is funding since 2007 our large-scale project entitled “NANOPACK – Nano Packaging Technology for Interconnect and Heat Dissipation.” The 14 partners of the project include major industries such as Thales (France), Bosch (Germany), IBM (Zürich Research Laboratories), SMEs and different academic teams throughout eight countries of the European Union.As a mean to gather scientists working on Thermal Interface Materials, advanced nanoscale-based heat transfer technologies and companies interested in better products, we are organizing a workshop to present the most up-to-date results and material performances for the next generations of cooling devices and processes in the automotive and industrial electronics sectors.
