Nordson ASYMTEK’s new automated workcell for film-frame wafer-level packaging applications, MH-910W, is designed for 150-mm film-frame wafer processing and is flexible enough to support various sizes. Applications include MEMs/image sensor capping, wafer coating for imaging devices such as digital light processing (DLP), life sciences for biochip reagent jet dispensing and jetting of thin coatings prior to laser dicing to reduce contamination or dust caused by ablation fall-out from the dicing process. The MH-910W same-side loader/unloader provides programmable transport speed to maximize units per hour while multiple sensors and active pinch wheels ensure safe handling.
Workcell for Automated Film-Frame Wafer Dispensing Applications
