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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Gap Filler Pad with Low-Tac Top Surface

New Products, TIMs , ,

Fujipoly’s new Sarcon® 50G-Hm is a high performance, low resistance gap filler pad manufactured with a special low-tac top surface.

The one-sided treatment is less sticky than the opposing surface allowing the thermal pad to adhere to either the target electrical component or opposing heat sink. This allows for quick and easy removal without ripping, warping or damaging the interface material.

Sarcon® 50G-Hm transfers heat with a thermal conductivity of 6.0 W/m°K and a very low thermal resistance of .16°Cin2/W at 72.5 PSI.  This 0.5mm thick, flame retardant TIM is available in sheets up to 300mm x 200mm.

Learn more from Fujipoly.

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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