MAYA HTT’s TMG-Thermal solver provides a comprehensive heat transfer simulation package, which allows fast and accurate solutions to complex thermal problems.
Using finite difference control volume technology, TMG-Thermal makes it easy to numerically simulate nonlinear and transient heat transfer processes including coupled conduction, radiation, free and forced convection, 1D duct flow hydaulic networks, and material phase change. Combined with TMG-Flow, it solves a wide range of multi-physics problems involving strong coupling of fluid flow and heat transfer.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.







