Overview Thermal Design Power (TDP) is a term commonly used in the thermal management of consumer electronics. While the usage of this terminology may vary across the industry, it commonly refers to the amount of power that a device may dissipate indefinitely, in a given thermal environment, without exceeding the temperature limits of the device. The TDP for a consumer … [Read more...]
Summary of SEMI-THERM 2023 Conference
The SEMI-THERM 39 Symposium was held March 13-16, 2023 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Marcelo del Valle (Infinera Corporation), Program Chair Alex Ockfen (Meta), and Program Vice Chair Lieven Vervecken (Diabatix). The Symposium included technical short courses, technical sessions, invited presentations, vendor exhibits … [Read more...]
A Figure of Merit for Smart Phone Thermal Management
INTRODUCTION With smart phones and other mobile devices available in a variety of sizes and shapes, it is challenging to think in a consistent and comparative manner about the effectiveness of the thermal management solutions that they employ. This is growing more important as the mobile and wireless industries and associated research communities explore novel mobile cooling … [Read more...]
Thermal Challenges with Wearable and Implantable Electronic Devices in Healthcare
INTRODUCTION Traditionally, medical science has depended on a variety of diagnostic tests administered by medical personnel to either detect the onset of an illness or to monitor its progress. More recently, this focus has been supplemented by a strategy of health maintenance and disease prevention. Both of these strategies benefit from the frequent testing of individuals. Of … [Read more...]
Development of a 3D Printed Loop Heat Pipe
ABSTRACT The small form-factor satellites, CubeSats and SmallSats, have increased in popularity and capability, but advanced thermal solutions are required to keep up with the increasing heat loads. Loop heat pipes (LHPs) are a passive solution capable of transporting heat from electronics to deployable radiator panels. However, due to their complicated structure, LHPs require … [Read more...]
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