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Electronics Cooling

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New System Improves Lead Times

 

A manufacturer of thermoelectric air conditioners, TECA Corporation, has recently implemented a new program to improve lead times. President of TECA, Mike Mikalauskis, said, "We were able to pair new software with a more streamlined production system. This will enable our customers to be more competitive when quoting jobs using our air conditioners." TECA further announced … [Read more...]

Metal Inverse Opals Could Better Cool Electronics

 

(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal management applications. Nanotechweb.org explained that “these materials are metal films that contain a periodic arrangement of interconnected spherical … [Read more...]

New Approach to Simulate Nanoscale Thermoelectric Materials

 

(April 7th, 2016) A research group led by Joe Feser, assistant professor in the Department of Mechanical Engineering at the University of Delaware, has developed a new approach to simulating nanoscale heat transfer in materials, according to Phys.org. More specifically, the research group is “investigating the limits of heat transport using a suite of new tools for nanoscale … [Read more...]

Small EHD Pump Solution May Cool Space Hardware

 

(April 13th, 2016) Michal Talmor, a Ph.D. candidate in mechanical engineering at the Worcester Polytechnic Institute (WPI) in Worcester, Massachusetts, is focused on bringing electrohydrodynamic (EHD)-based thermal control to space exploration devices. Now in the second year of her NASA Space Technology Research Fellowship (NSTRF), according to I-Connect007.com, “Talmor’s … [Read more...]

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