Recently SANYO DENKI has released their new high static pressure fan, the San Ace 60 9HV type. The San Ace 60 9HV type is 60 x 60 x 38 and has a PWN control function, which controls the “rotational speed of the fan from the device side,” according to the company. It is suitable for 1.5 to 2U sized devices and has a maintained maximum airflow performance equivalent to the … [Read more...]
New “Kinetic Cooling Engine” CPU Cooler Design
Startup MIT company, CoolChip, demonstrated a new commercial prototype CPU cooler recently at CES. “They’ve partnered with Cooler Master to release a “kinectic cooling engine” that can cool a chip 50 percent more efficiently than a conventional cooler, in a form factor that’s half the size and emits much less noise,” according to Spectrum IEEE. It is true that “Sandia Labs … [Read more...]
Redesigned Heat Sinks Using 3D Printers
Plunkett Associates has successfully redesigned heat-sinks to improve convection cooling performance using Direct Metal Laser Sintering (DMLS), or 3D printing. “Each heat-sink was first produced in virtual form and simulated using Computational Fluid Dynamics (CFD) software,” reported 3Ders.org. “The top five heat-sinks were then built by 3T RPD Ltd. using DMLS and physically … [Read more...]
IEEE Electronic Components and Technology Conference – ECTC 2016
IEEE Electronic Components and Technology Conference – ECTC 2016 Las Vegas, NV, USA May 31 – June 3, 2016 For more information, click here. … [Read more...]
The Appification of CFD Simulation has Started
There has been much talk about the appification of established technologies. Discussion on the appification of high-value CAE simulation seems to have focused on the fact that it's a when, not if. How such a conclusion has been made without a clarification of what 'appification' actually is, is confounding. Apps are cheap, limited in the scope of their application and, as a … [Read more...]
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