Recently, Moscow Institute of Physics and Technology researchers Dmitry Fedyanin and Andrey Vyshnevyy have solved and “demonstrated how to efficiently cool optoelectronic microprocessors” by using industry-standard heat sinks, according to Phys.org. Optoelectronic chips’ active plasmonic components tend to overheat from high-speed data transfer, but by switching electrons with … [Read more...]
New High Static Pressure Fan Released
Recently SANYO DENKI has released their new high static pressure fan, the San Ace 60 9HV type. The San Ace 60 9HV type is 60 x 60 x 38 and has a PWN control function, which controls the “rotational speed of the fan from the device side,” according to the company. It is suitable for 1.5 to 2U sized devices and has a maintained maximum airflow performance equivalent to the … [Read more...]
New “Kinetic Cooling Engine” CPU Cooler Design
Startup MIT company, CoolChip, demonstrated a new commercial prototype CPU cooler recently at CES. “They’ve partnered with Cooler Master to release a “kinectic cooling engine” that can cool a chip 50 percent more efficiently than a conventional cooler, in a form factor that’s half the size and emits much less noise,” according to Spectrum IEEE. It is true that “Sandia Labs … [Read more...]
Redesigned Heat Sinks Using 3D Printers
Plunkett Associates has successfully redesigned heat-sinks to improve convection cooling performance using Direct Metal Laser Sintering (DMLS), or 3D printing. “Each heat-sink was first produced in virtual form and simulated using Computational Fluid Dynamics (CFD) software,” reported 3Ders.org. “The top five heat-sinks were then built by 3T RPD Ltd. using DMLS and physically … [Read more...]
IEEE Electronic Components and Technology Conference – ECTC 2016
IEEE Electronic Components and Technology Conference – ECTC 2016 Las Vegas, NV, USA May 31 – June 3, 2016 For more information, click here. … [Read more...]
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