TECA introduces a new line of coolers, which are internally mounted air conditioners ideal for enclosure cooling. Because these thermoelectric coolers are highly reliable and almost maintenance free, they are ideal for areas that are hard to access. They also don’t have refrigerants, compressors or any moving parts except fans. The coolers offer horizontal or vertical … [Read more...]
Researchers Send De-ionized Water Within Few Hundred Microns of Transistors
Researchers from the Georgia Institute of Technology have announced a breakthrough in increasing processing power. “Their innovative design involves sending liquid coolant—in the form of de-ionized water—through microfluidic passages within a few hundred microns of the transistors, allowing chips to operate at temperatures more than 60 percent lower than air-cooled chips,” … [Read more...]
Graphene-based Inks Yield Low Cost and High Speed Printing in Electronics
A team of researchers at the University of Cambridge, along with the Cambridge-based company Novalia, have produced new graphene-based inks which could lead to high-speed manufacturing of printed electronics. The method involves adding graphene and electrically conducting materials to water-based inks for printing. This is the first time graphene has been used for large-scale … [Read more...]
New Thermal Management Material for Semiconductors
Honeywell Electronic Materials has announced the availability of a new thermal management material for semiconductors – the Honeywell PTM6000 Phase Change Material (PCM). The PTM6000 was designed to meet both high performance needs and long lasting reliability. “Honeywell’s proven PTM and PCM series of thermal management materials are based on sophisticated phase-change … [Read more...]
One-component Epoxy Cures at 200-220°F
Master Bond introduces a new one-component epoxy, the Master Bond EP17HT-100, which is resistant to high temperatures and cures in 60-90 minutes at 200-220 degrees Fahrenheit. The EP17HT-100 is ideal for bonding, encapsulation, potting and sealing applications. “Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications … [Read more...]
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