During the ISAL 2015 automotive lighting symposium, Osram Opto Semiconductors introduced a 2,000 lm prototype headlamp LED called the Oslon Black Flat S. Compared with its predecessor, the headlamp LED has enhanced chips and thermal management. “Larger contact pads are partly responsible for better cooling – at 3.75×7.9mm it is slightly larger than its predecessor. When … [Read more...]
Ceramic Adhesive Bonds Thermocouples to High-Temp Heater
Aremco Products, Inc. recently launched the Ceramabond™ 571, a new high temperature magnesium oxide based ceramic adhesive. It is used to bond thermocouples to high temperature molybdenum-rhenium heater tubes for applications to 3200o F (1760 ºC). “Ceramabond™ 571 is ideal for assembling and insulating ceramic and metal components used in high temperature devices. It … [Read more...]
New Reversible Flow Fan Blows Air in Both Directions
SANYO DENKI CO., LTD. introduces the San Ace 136RF ø136 mm × 28 mm Reversible Flow Fan that blows air in both directions. “Rotational speed is controlled using an external PWM signal to deliver an appropriate rotational speed, reducing noise and saving energy,” the company said. The San Ace 136RF ø136 mm × 28 mm Reversible Flow Fan has about the same airflow and static … [Read more...]
Heat Sink Optimization through Use of Pin Fins
In a recent blog post, Robert Smith discusses heat sink optimization through the use of pin fins. “Local heat transfer coefficients are highest when the air first begins to form a boundary layer. The benefit to lots of pins is that you force the boundary layers to break away often and re-create on the next pin,” Smith said. The heat sink forms a 3D mesh of pins that cross … [Read more...]
ITherm 2016: Fifteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
ITherm 2016: Fifteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems May 31 – June 03, 2016 Las Vegas, Nevada, USA ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. … [Read more...]
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