CoolIT Systems, Inc. announced the U.S. Patent and Trademark Office has granted the company three new patents for liquid cooling. With these, CoolIT Systems has reached its 50th patent milestone. The three newly issued patents include USPTO 9057567 Microchannel Coldplate, USPTO 9052252 Leak Detection System and USPTO 9055697 Air Conditioning System Control. “USPTO 9057567 … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense Extended Article
Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
An All-Silicon Field Programmable Thermal Emulator for Integrated Circuits
By: Wen Yueh, Khondker Z. Ahmed, and Saibal Mukhopadhyay School of ECE, Georgia Institute of Technology Introduction Thermal test chips with integrated thin-film heaters via post-processing are often used as the test structure to evaluate thermal integrity of the packages and cooling solutions [1]. In advanced silicon technologies (sub-45nm nodes), the chip’s thermal … [Read more...]
The Holy Books of Heat Transfer: Facts or Fairy Tales
By: Clemens J.M. Lasance; Guest Editor The answer to the question stated in the title is both! It all depends on whether or not your situation is truly similar to the situation described in the book (physically congruent, fluid mechanically and thermally similar). Very few heat transfer books provide detailed dimensions and flow conditions for the experimentally observed … [Read more...]
Data Center Energy Savings: Total Liquid Cooling Versus Indirect Liquid Cooling
By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible when liquid is supplied to the racks [1]. A solution which has become popular for dense racks is the rear-door water-cooled heat … [Read more...]
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