The recent discovery of a new magnetocaloric material with intriguing characteristics could lead to a greener method of cooling, potentially providing a more environmentally-friendly alternative to standard refrigeration. A joint team of researchers from Canada and Bulgaria have developed a new method of green cooling by identifying a multiferroic compound, HoMn2O5, that could … [Read more...]
Adhesive Cures at Temperatures as Low as 60°C
DELO, a manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, has released a new heat-curing adhesive that cures to full strength in temperatures as low at 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging and other applications where … [Read more...]
New Device to Cool Chips at the Micro-Scale
Researchers at the University of California, Berkeley and the University of California, San Diego have developed a novel evaporator structure that can be integrated directly into electronics to cool chips with micro-sized components. “The idea behind this project is to use liquid, in this case de-ionized water, to absorb the heat produced by any kind of device, then evaporate … [Read more...]
Thermal Adhesive Tape Reduces PCB Production Time
Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the PCBs to be finished/ supplied with a thermally conductive, mechanical fixing tape pre-applied and thus reducing … [Read more...]
Rugged Circuit Functions at Temperatures Greater than 350 Degrees Celsius
Researchers at the University of Arkansas have developed integrated circuits capable of surviving at temperatures greater than 350 degrees Celsius, or approximately 660 degrees Fahrenheit. Created using silicon carbide, a semiconducting material that is more rugged than conventional materials used in electronics, the new circuits are expected to improve the operation of analog … [Read more...]
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