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Electronics Cooling

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Form-in-Place Thermal Compound for Delicate or Low Compression Requirements

 

Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K. Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low compression requirements. According to the company, the new thermal compound will not cause corrosion on metal surfaces and … [Read more...]

Graphene Improves Copper Film Thermal Conductivity

 

The placement of a single atomic plane of graphene on the surface of a copper film can significantly increase the film’s thermal conductivity, making the hybrid material ideal for more demanding thermal management applications, according to new research from scientists at the University of Manchester, UK and the University of California-Riverside, U.S. The phenomenon was … [Read more...]

Magnetically-Stimulated Flow Patterns Could Boost Heat Transfer

 

Magnetically-stimulated fluid flow patterns may offer a new method for handling difficult heat transfer problems by overcoming natural convection limits, according to new research from scientists at Sandia National Laboratories. Convection cooling, which refers to the transfer of heat between two places by the movement of fluids, is often forced in many modern cooling systems … [Read more...]

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