SEMI-THERM has awarded the 2014 THERMI Award to Ali Shakouri. Presented yearly, the THERMI award is intended to recognize a recipient’s history of contributions to crucial thermal issues affecting the performance of semiconductor devices and systems. Shakouri was selected as this year’s winner by the voting body of past THERMI winners and current General Chair Genvieve Martin … [Read more...]
Expanded Product Catalog Features New Thermal Interface Materials
Fujipoly has released its new thermal interface material and elastomeric connector product catalog. The 52-page product overview and technical guide includes design guidelines as well as detailed thermal performance and electrical conductivity data points. Several new pages of high-performance, low-cost thermal materials have been added to complement the company’s current … [Read more...]
Thermal Pad Offers Advantages of Thermal Grease Without Mess
AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of thermal expansion (CTE) deficiencies. Naturally tacky with no adhesive, fiberglass or other non-conductive … [Read more...]
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design of thermal engineering and heat rejection technologies. The need for performance inevitably leads to operation of most … [Read more...]
Bitcoin 2-Phase Immersion Cooling and the Implications for High Performance Computing
Alex Kampl Allied Control Company Abstract Recently, Bitcoin and Bitcoin mining have aroused international interest. This article describes the cooling challenges faced by Bitcoin miners and discusses the implications on the future of cooling for supercomputers, HPC clusters and other high density electronics. We explain the inner workings of the first commercial open … [Read more...]
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