Saint-Gobain Ceramic Materials has released its new CarboTherm boron nitride thermal management fillers for use in thermally conductive, dielectric plastic compounds. The new boron nitride fillers will be on display December 10-11 at the Compounding World Forum 2013 in Philadelphia, Penn., USA. “Boron nitride, unlike other ceramics, is soft and non-abrading, enabling longer … [Read more...]
Thermal Packaging – From Problem Solver to Performance Multiplier
The increased integration density of electronic components and subsystems, including the nascent commercialization of 3D chip stack technology, has exacerbated the thermal management challenges facing electronic system developers. The sequential conductive and interfacial thermal resistances associated with the prevailing “remote cooling” paradigm in which heat must diffuse … [Read more...]
New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential
Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new Dow Corning Dispensable Thermal Pads offer the potential for broader design latitudes, simplified … [Read more...]
Thermal Facts & Fairy Tales: How Useful Are Heat Sink Correlations for Design Purposes?
Clemens J.M. Lasance Guest Editor, Philips Research Emeritus, Consultant at SomelikeitCool I assume everybody agrees with the fact that it is pointless to devote precious space in this magazine to highlight again all problems related to thermal management of electronic products and systems, so let’s start right away. An important way of reducing the temperature in an optimal … [Read more...]
Electronics Cooling December 2013 Issue Now Online
Don’t miss out on the December 2013 issue of Electronics Cooling, which includes feature articles on Energy-Efficient Warm-Water Cooling of Servers; Thermal Management of Many-core Processors using Power Multiplexing, Characterization of Server Thermal Mass; as well as a calculation corner and technical briefs. If you would like to receive your free copy of Electronics … [Read more...]
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