Thermoelectric air conditioner supplier EIC Solutions has expanded its line of ThermoTEC thermoelectric coolers with the addition of a high ambient temperature model. Designed to cool electronic enclosures in extremely hot settings such as in deserts, or in high heat industrial applications such as those near blast furnaces, the new thermoelectric units are capable of … [Read more...]
Patent for Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader
The U.S Patent and Trademark Office has awarded patent No. 8, 587,947, “Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader” to Shinko Electric Industries Co., Ltd. of Japan. According to background information supplied by the inventors, “there are proposed various heat spreaders for spreading heat generated from an IC chip mounted on an IC … [Read more...]
New Gap Filler Offers Thermal Conductivity of 1.3W/m-K
The Bergquist Company has released the Gap Pad 1450 thermally-conductive gap filler. Designed to provide low strain on fragile components, the new gap filler is ideal for a variety of applications, including lighting and LED, computer and peripherals and telecommunications. Featuring a thermal conductivity of 1.3W/m-K, Gap Pad 1450 is available in six thicknesses from … [Read more...]
New Thermal Modeling Programs Offer Wide Range of Application Simulations
Software designer Cradle Co., Ltd. has announced the release of version 11 of its SC/Tetra, scSTREAM/Heat Designer, and EOopti thermal modeling programs. SC/Tetra is the unstructured grid Computational Fluid Dynamics (CFD) software for simulations in various industries including automotive, turbo-machinery, and other product designs. Version 11 offers a new “Modify Solid” … [Read more...]
Technique Combines Heat Sinks for More Effective Cooling
Researchers at the National University of Singapore have developed a new two-phase technique they say is up to 50 percent more effective in cooling electronic systems compared to current cooling technology. Led by Lee Poh Seng, Ph.D., of the Department of Mechanical Engineering at NUS, the team combined microgap and stepped fin microchannel heat sinks to create a two-phase … [Read more...]
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