Don’t miss out on the December 2013 issue of Electronics Cooling, which includes feature articles on Energy-Efficient Warm-Water Cooling of Servers; Thermal Management of Many-core Processors using Power Multiplexing, Characterization of Server Thermal Mass; as well as a calculation corner and technical briefs. If you would like to receive your free copy of Electronics … [Read more...]
Thermoelectric Coolers for High Temperature Environments
Thermoelectric air conditioner supplier EIC Solutions has expanded its line of ThermoTEC thermoelectric coolers with the addition of a high ambient temperature model. Designed to cool electronic enclosures in extremely hot settings such as in deserts, or in high heat industrial applications such as those near blast furnaces, the new thermoelectric units are capable of … [Read more...]
Patent for Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader
The U.S Patent and Trademark Office has awarded patent No. 8, 587,947, “Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader” to Shinko Electric Industries Co., Ltd. of Japan. According to background information supplied by the inventors, “there are proposed various heat spreaders for spreading heat generated from an IC chip mounted on an IC … [Read more...]
New Gap Filler Offers Thermal Conductivity of 1.3W/m-K
The Bergquist Company has released the Gap Pad 1450 thermally-conductive gap filler. Designed to provide low strain on fragile components, the new gap filler is ideal for a variety of applications, including lighting and LED, computer and peripherals and telecommunications. Featuring a thermal conductivity of 1.3W/m-K, Gap Pad 1450 is available in six thicknesses from … [Read more...]
New Thermal Modeling Programs Offer Wide Range of Application Simulations
Software designer Cradle Co., Ltd. has announced the release of version 11 of its SC/Tetra, scSTREAM/Heat Designer, and EOopti thermal modeling programs. SC/Tetra is the unstructured grid Computational Fluid Dynamics (CFD) software for simulations in various industries including automotive, turbo-machinery, and other product designs. Version 11 offers a new “Modify Solid” … [Read more...]
- « Previous Page
- 1
- …
- 176
- 177
- 178
- 179
- 180
- …
- 482
- Next Page »
