Researchers at the National University of Singapore have developed a new two-phase technique they say is up to 50 percent more effective in cooling electronic systems compared to current cooling technology. Led by Lee Poh Seng, Ph.D., of the Department of Mechanical Engineering at NUS, the team combined microgap and stepped fin microchannel heat sinks to create a two-phase … [Read more...]
New CFD Software Update Offers Efficient Handling of Advanced Designs
Thermal simulation and analysis products supplier Mentor Graphics Corp. has released the next generation of its FloTHERM computational fluid dynamics software program with the addition of a new native Windows graphical user interface (GUI) to handle pre-processing and large models with ease for advanced electronic designs. According to the company, the new version includes a … [Read more...]
Magnetic Nanoparticles Prevent Hotspots in Cooling Systems
An international team comprised of researchers at MIT and in Australia has discovered a way to enhance heat transfer using magnetic fields, a method they say could prevent hotspots that can lead to system failures. The new system, which relies on tiny particles of magnetite, a form of iron oxide, is the result of several years of research on nanofluids—nanoparticles dissolved … [Read more...]
Connectors for Liquid Cooling Applications
Colder Products Company, a provider of quick disconnect couplings and fittings for plastic tubing, has released the new LQ6 series connectors. Designed specifically for liquid cooling applications requiring multiple connect and disconnect cycles, these specialized couplings deliver reliability, security and ease-of-use in cooling applications where a drip-free connection is … [Read more...]
Flexible Thermal Absorbing Films Boost Heat Dissipation in Small Electronics
Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic devices. “Managing the intense heat generated by today’s handheld products is one of the biggest challenges facing device designers today,” Jonathan Rowntree, vice president of … [Read more...]
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