CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs January 10, 2023 AUSTIN, TX--Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant … [Read more...]
Thermal Comfort Considerations for Electronics Cooling and Design
Written by: Mark Hepokoski, ThermoAnalytics and Alex Ockfen, Meta Reality Labs Introduction ASHRAE defines thermal comfort as “that condition of mind that expresses satisfaction with the thermal environment” [1]. While engineers and designers are typically familiar with the thermal safety and compliance standards required in their industry [2], thermal comfort is less well … [Read more...]
Heat Transfer and Pressure Drop Correlations for Manifold Microchannel Heatsinks
Written by: Sevket U. Yuruker, Raphael K. Mandel, Amir Shooshtari and Michael M. Ohadi - Department of Mechanical Engineering, University of Maryland Conventional microchannel cooling has been proven capable of removing high heat fluxes, but usually at significant pressure drops. On the other hand, manifold microchannel systems offer high heat transfer coefficients/heat … [Read more...]
Machine Learning Optimization to Boost the Effectiveness of Phase Change Material (PCM)-Based On-Chip Passive Thermal Management
Written by: Dr. Amy Marconnet and Meghavin Bhatasana - Purdue University Although miniaturization of electronic components has helped advance computing power and accelerated technology development, it has increased power densities and exacerbated the already challenging issue of electronics cooling at the component level. Continuous operation at high temperatures degrades … [Read more...]
Breaking Grounds with Generative Design for Two-phase Cooling of Electronic Devices
Since the size of electronic components keeps on decreasing, the need for improved heat dissipation on these components keeps increasing. This dichotomy presents thermal engineers with a formidable challenge: how to design smaller coolers that dissipate more heat. Adding to the challenge, the fast-paced evolution of electronics means that the development time for the new cooler … [Read more...]
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