Late in 1988 two key employees of CHAM (Concentration Heat And Momentum Ltd.), the first commercial CFD vendor and at the time market leader, left to set up a new type of CFD company. Recognising the opportunity to package CFD in focussed, highly automated and application specific products, David Tatchell and Harvey Rosten started to develop what would become FloTHERM. A CFD … [Read more...]
Registration Opens for SEMI-THERM 2014
The 30th Annual SEMI-THERM Symposium and Exhibition will be held March 9-13, 2014 at the Doubletree Hotel in San Jose, California, USA. Registration for SEMI-THERM is now open. Thermal management is a critical consideration in the design and manufacture of consumer products, military and medical devices, lighting and in the processing of Big Data. As more video, graphics and … [Read more...]
Patent for Thermal Interface Material with Thin Transfer Film or Metallization
The U.S. Patent and Trademark Office has awarded patent No. 8,545,987, “Thermal Interface Material with Thin Transfer Film or Metallization” to Laird Technologies, Inc. of Earth City, Mo., USA. According to background information provided by the inventors, the patent covers, “a thermal interface material assembly comprising: a thermal interface material having a first side and … [Read more...]
Heat Sink Watch Helps Wearer Manage Body Temperature
Four engineering students at MIT have developed a thermoelectric bracelet designed to help wearers maintain a comfortable body temperature. Resembling a wristwatch, the invention, known as Wristify, monitors air and skin temperature and sends pulses of hot or cold waveforms to the wrist when needed to help the wearer maintain thermal comfort. A custom copper-alloy-based heat … [Read more...]
Defense Contractors to Develop Next-Gen Military Electronics Thermal Management
U.S. Air Force officials have awarded multimillion dollar contracts to BAE Systems and Boeing Co. as part of DARPA’s Intrachip/Interchip Enhanced Cooling Applications (ICECool Applications) program. The ICECool program seeks to develop advanced electronics cooling techniques for high-performance embedded computer (HPEC) and RF monolithic microwave integrated circuit (MMIC) … [Read more...]
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