Fujipoly has released new Sarcon GR25A-0H2-30GY, a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. According to the company, the material’s new formulation dramatically reduces material tearing and damage during assembly and rework operations and improves cooling performance by filling unwanted air gaps between board components and … [Read more...]
Thermal Characterization of Electronic Components & Systems
November 13, 2013 Frankfurt, Germany Presented by Mentor Graphics, this one-day seminar will cover a measurement system for the fast and very accurate thermal characterization of electronic components and systems (IC packages, MOSFETS, IGBTs, etc.). Attendees will experience hands-on practical exercises with the T3Ster Measurement System. For more information, visit Mentor … [Read more...]
Advanced Technology Workshop and Tabletop Exhibit on Thermal Management
November 5-7, 2013 Los Gatos, California, USA The purpose of this workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials and systems solutions for removing, spreading and dissipating heat from microelectronic devices and systems. The workshop emphasis is on practical, … [Read more...]
Patent Awarded for Free Cooling Solution for a Containerized Data Center
The U.S. Patent and Trademark Office has awarded patent No. 8,554,390, “Free Cooling Solution for a Containerized Data Center,” to the International Business Machines Corporation in Armonk, N.Y., USA. “There is a problem in that the cost of operating today's data centers continues to rise and come under closer and closer scrutiny,” the inventors explain in their summary. … [Read more...]
Wind Tunnel for Thermal and Airflow Testing of Multiple PCBs
Omega Engineering has released the new WT-3200 series of wind tunnels for thermal and airflow testing of multiple PCBs. Featuring a 2-D converging nozzle with a multi-point measurement area for sensor placement upstream of the test section, the test chamber can accommodate up to six PCBs with 13 mm (0.5 in) card-to-card spacing or three PCBs with 25 mm (1 in) card-to-card … [Read more...]
- « Previous Page
- 1
- …
- 181
- 182
- 183
- 184
- 185
- …
- 482
- Next Page »
