Scientists, at the Vienna University of Technology have developed a new class of thermoelectric materials they claim can be used to create electricity more efficiently. According to the researchers, the material’s unique structure, which consists of countless tiny magnetic crystal “cages” known as clathrates with cerium atoms enclosed inside, is the key reason for its increase … [Read more...]
Thermal Management Expo Taiwan 2013
October 23-25, 2013 Taipei, Taiwan Thermal Management Expo Taiwan 2013, part of the Taiwan Printed Circuit Association Show, will cover a wide range of topics pertaining to electronics thermal management, including thermal design, product development and applications, and thermal measurement and modeling. … [Read more...]
SAE 2013 Thermal Management Systems Symposium
October 22-24, 2013 Troy, Michigan, USA With the advent of new vehicle powertrains such as hybrid, electric and fuel cell, determining how to handle vehicle heating and cooling has become a paramount issue in the mobility industry. All thermal management systems, including mobile air conditioning systems, require new concepts to provide passenger compartment heating and … [Read more...]
New Micro-Controlled DC Fans
Fan manufacturer JMC Products has released the Edison micro-controlled “intelligent” DC fan that offers efficient power consumption, various alarms and speed feedback. In addition to standard micro-control benefits, says the company, the new Edison Fan also includes closed loop PWM (pulse width modulation) speed control, enabling the fan to maintain its PWN to RPM relationship … [Read more...]
Patent Covers Methods of Making, Cooling Semiconductor Packages
The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves within a semiconductor die backside, and includes semiconductor packages utilizing carbon nanostructures (such as, for … [Read more...]
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