Electronic components manufacturer ASSMANN WSW has released a new series of stamped CPU heat sinks for cooling pin grid arrays, ball grid arrays or other high power components. The series is available from distributor Rutronik. According to the company, the new CPU heat sinks offers an improve air convection of up to five percent because of non-simultaneous heating from one … [Read more...]
View our Webinar and Q&A on ‘Advanced Carbon-Based Thermal Management Materials and Applications ’
On September 25, 2013, Carl Zweben presented a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are being used in a large and increasing number of commercial and aerospace/defense applications. Examples include various … [Read more...]
New PMIC Reduces Thermal Stress in Processors
High performance analog IC and sensor provider ams AG has introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit designed to help reduce the thermal stress of applications processors in smartphones and tablets. When paired with ams’ new AS3729 point-of-load regulators, AS3721 provides a complete power management system that offers a fast … [Read more...]
Webinar Question & Answers
Editor’s note: These questions were asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Al/SiC is an attractive material. Is there a need for other new composites? Answer: There is no one universal material. There is a need for low-CTE materials with thermal conductivities higher than those of … [Read more...]
Material Solutions for High-Frequency, High-Thermal-Reliability and Multilayer Circuits
Rogers Corporation, a manufacturer of specialty materials and components that enable high performance and reliability of consumer electronics, power electronics and telecommunications infrastructure, will be featuring its new high-Dk RO4360G2 laminate and 2929 bondply materials at the PCB West 2013 conference and exhibition Sept. 25, 2013 in Santa Clara, Calif. According to … [Read more...]
- « Previous Page
- 1
- …
- 186
- 187
- 188
- 189
- 190
- …
- 483
- Next Page »
