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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Gap Filler Thermal Interface Material for Silicone-Sensitive Electronic Applications

 

The Bergquist Company, a supplier of thermal management materials, has released Gap Filler 1500LV, a new “low volatility, two-component, liquid-dispensable thermal interface material that offers the high temperature resistance and low modulus of a silicone material with minimal outgassing.” According to the company, the new gap filler is ideal for use with fragile components … [Read more...]

Why Not Just Shove a Heatsink on Top of it? Part 3: Pads, Vias and Undersinking

 

An appreciation of heat flow paths is a pre-requisite for good thermal design. If you attempt to augment heat flow where there is none then your expectations are as futile as your design skills. The real value of simulation for me is that it enables an insight into the behaviour of a proposed design (this is true for simulation of any design and any behaviour). Once you … [Read more...]

View our Webinar and Q&A on 'Advanced Composite Thermal Management Materials and Applications'

 

  On June 26 Carl Zweben presented a live webinar on Advanced Composite Thermal Management Materials and Applications. Overview: This presentation covers key advanced composite thermal management materials and applications.  We also look at current and future advanced reinforcements, such as diamond particles, carbon nanotubes, graphene and graphite nanoplatelets. The … [Read more...]

Predictive DCIM Webinar

 

June 27, 2013 Online In this webinar, Future Facilities will cover data center infrastructure management and how to best maintain and prevent a loss of capacity. “At $10 to $30M per MW, data center capacity is a major, capital investment for any company. After the investment has been made, each unit of capacity must be put to good use in the same way that companies need … [Read more...]

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