Patented design enables board designers to place the new AS3721 PMIC and applications processor further apart to reduce hotspot intensity. Ams AG, a provider of high performance analog ICs and sensors, has introduced the AS3721, a power management IC with a remote-feedback circuit that helps manage the thermal stress of applications processors in space-constrained … [Read more...]
Micro-Vacuum Technology May Cool Future Smartphone Processors
Researchers from the University of Michigan, Massachusetts Institute of Technology (MIT) and Honeywell International, Inc. have developed microscale vacuum pumps that could lead to tiny, more efficient cooling systems for faster processors in smartphones. Developed as part of DARPA’s Chip-Scale Vacuum Micro Pumps (CSVMP) program, the new microscale vacuum pumps are intended … [Read more...]
Electronics Cooling Announces New Editor
Electronics Cooling is proud to announce the addition of Peter Rodgers to the technical board. Rodgers is currently an associate professor of mechanical engineering at The Petroleum Institute, Abu Dhabi, UAE. He previously worked at the University of Maryland; Nokia (Finland); Electronics Thermal Management, Ltd. (Ireland), and the University of Limerick (Ireland). He is a … [Read more...]
Editorial: Thermal Engineering and the Search for the Higgs Boson
In science, it’s rare that a revolutionary new theory is not preceded by groundbreaking experiments. More often than not, the timing of such experiments has depended on prior advancements in technology and engineering. The Large Hadron Collider (LHC) at CERN near Geneva, Switzerland, where the critical experiments to find the Higgs boson were conducted, depended for its … [Read more...]
Manufacturing Plant for Nanoceramic-Aluminum Substrate Technology to Be Built in Haverhill
Electronics thermal management provider Cambridge Nanotherm has announced plans to build its first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB). The company plans to use the new facility to further develop its new nanoceramic-aluminum substrate technology, and to … [Read more...]
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