Researchers at Arizona State University have announced a breakthrough in nanolaser technology that could enable electrically-powered nano-scale lasers to perform reliability at room temperature and facilitate their use in a variety of practical applications. While scientists have long believed that nanolasers have the potential to help computers and other electronic devices … [Read more...]
Nanoscale Heat Transfer Research Awarded Air Force Grant
An Arizona State University engineer has been awarded a grant from the U.S. Air Force Office of Scientific Research for nanoscale heat transfer research that could help improve thermoelectric devices and thermal barrier coatings. An assistant professor of aerospace and mechanical engineering at ASU’s School for Engineering of Matter, Transport and Energy, Robert Wang was … [Read more...]
Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM materials simpler and more cost-efficient, and are comprised of the company’s thermal test chip—available in sizes ranging from 2.5mm square to … [Read more...]
Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
Graphite mining and exploration company Focus Graphite Inc. has announced a joint venture development agreement on behalf of Grafoid Inc. with CapTherm Systems Inc., a developer of cooling technologies for high-power electronics, to develop and commercialize next-generation, multiphase thermal management systems for electric vehicle (EV) battery and light emitting diode (LED) … [Read more...]
Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology
In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is modelled explicitly, no abstraction into a thermal resistor equivalent model, no hiding all the proprietary design information inside either. Pros and cons of detailed models I covered a few years ago in this blog. Packaged ICs are complex, constructed of many parts, … [Read more...]
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