The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance WILMINGTON, Del., June 3, 2022 - Laird Performance Materials, part of DuPont Interconnect Solutions, has capitalized on collaborative innovation with DuPont to introduce Laird™ Ttape™ 1000A thermally conductive adhesive tape, a standalone 50µm adhesive that offers extremely … [Read more...]
Thermally Optimizing a High-Power PCB for Battery Powered Electronics
Introduction The growth of battery powered applications is presenting new challenges for designers of electronic motor-driven solutions. Targeting higher performance and efficiency, the power stages of these products must manage high currents while meeting strict power dissipation and size requirements. This article illustrates a thermally aware workflow with Cadence® Celsius™ … [Read more...]
Digital Edge Specifies Nortek’s StatePoint® Liquid Cooling Technology for Upcoming Philippines Data Center
Digital Edge to achieve Power Usage Effectiveness and Water Usage Effectiveness sustainability goals with StatePoint® Oklahoma City, (May 17, 2022)—Digital Edge (Singapore) Holdings Pte. Ltd., (“Digital Edge”), a leading Asian data center developer and operator, leverages StatePoint® liquid cooling technology manufactured by Nortek Data Center Cooling™, Oklahoma City, for … [Read more...]
Arieca Announces $6.5M Series A Funding Round
Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials (TIMs). May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca Inc., the leader in liquid-metal based thermal interface materials for high performance computing and high power semiconductor devices, … [Read more...]
Arieca Announces an Agreement to Develop a Liquid-Metal-Based Thermal Interface Material for Power Modules in the Electric Vehicle (xEV) Segment
May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca, a leader in liquid-metal-based Thermal Interface Materials (TIM), entered into a joint research agreement with ROHM Co., Ltd., a leading provider of power semiconductor devices for the xEV market, to develop next-generation TIM using Arieca’s Liquid Metal Embedded Elastomer(LMEE) Technology. This … [Read more...]
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