March 17-21, 2013 Long Beach, Calif. Considered to be one of the leading conferences for practicing power electronics professionals, APEC 2013 will focus on the practical and applied aspects of the power electronics business. The conference will offer professional development courses, presentations of peer-reviewed technical papers and networking opportunities. Attendees will … [Read more...]
Acquisition of R.O.C. Fan Design and Manufacturing Company Adds New Blowers and Fans to Global Thermal Management Product Line
Thermal management solutions provider Aavid Corp. has announced the acquisition of Republic of China fan design and manufacturing company NS Motor Technology. The acquisition brings a wide array of fans and blowers to Aavid Corp.’s thermal management solutions product line. “This latest addition to our capabilities and product offerings enhances our leadership position as the … [Read more...]
Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
STULZ Air Technology Systems, Inc., a provider of cooling solutions and services for mission critical applications, has released the STULZ CyberCon modular outdoor cooling system designed for fast deployment with containerized computer rooms (PODs). According to the company, the new cooling system’s modular design “reduces up-front capital costs and adapts to rapidly changing … [Read more...]
Modular Aisle Containment Solution Separates Hot and Cold Airflows in Energy-Efficient Manner
Data center developer Minkels has released its Next Generation Cold Corridor, “a modular and highly flexible aisle containment solution that separates hot and cold airflows in an energy-efficient manner.” The new data center cooling solution was presented London’s Data Centre World 2013 conference in late-February. According to Jeroen Hol, chief executive officer at Minkels, … [Read more...]
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
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