Asetek, a developer of energy efficient liquid cooling systems for data centers, servers and high performance PCs, has announced the issuance of two new patents. Issued by the U.S. Patent Office, patent no. 8,358,505 covers technology used for liquid cooling of “small form factor computing devices,” including laptops and blade servers. Patent no. 2005800500092, issued by the … [Read more...]
New Type of Heat-Conducting Paste “Optimized” for Thermal Management of Power Semiconductors
Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher power density for the same ageing resistance. According to Dr. Martin Schulz of Infineon Technologies AG, “[LOCTITE TCP 7000] … [Read more...]
Microsoft to Expand Hybrid Indoor-Outdoor “Roofless” Data Center
Microsoft has announced that the company’s newest data center campus will be expanded to include two more data center facilities. Located in Boydton, Va., the facility houses server racks both indoors and outdoors within larger enclosures as part of a hybrid design engineered to reduce operating costs and increase energy efficiency. The new expansion will bring the data … [Read more...]
Thermal Imaging Camera Kit Offers Less Than 50mK Sensitivity
Omega Engineering Inc., a manufacturer of measurement and control instruments for a range of applications, has released thermal imaging camera kit model OSXL-A35SC for thermal benchtop testing applications. According to the company, the new thermal imaging camera kit features “plug-and-play” compatibility, fast data transfer, a wide temperature range and less than 50mK … [Read more...]
Experiment vs. Simulation, Part 3: JESD51-14
The JESD51-14 standard was published in November 2010, prepared by the JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This is the thermal resistance between the die and the package case face. More specifically the face of the package that is to be cooled by an external … [Read more...]
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