March 17-21, 2013 San Jose, Calif. The 29th annual thermal measurement, modeling and management symposium provides a forum for researchers, members of academia and members of industry to discuss the latest technical developments in the thermal management of electronic devices, components and systems. Learn more. … [Read more...]
ICHTA 2013: International Conference on Heat Transfer and Applications
March 5-6, 2013 Dubai, United Arab Emirates The 34th International Conference on Heat Transfer and Applications will bring together academic scientists, researchers and students for the exchange of personal experiences, research results, theories and practical applications pertaining to all aspects of heat transfer and applications. Learn more. … [Read more...]
Advanced Knowledge of Electronics Cooling
February 28, 2013 - Munich, Germany June 6, 2013 - Stuttgart, Germany Hosted by Mentor Graphics, this course uses intensive mathematics to enhance the physical understanding of thermal behavior. Course topics include heat transfer and friction in moving fluids, interface materials, measurement methods for temperature and flow and the integration of simulation and measurement … [Read more...]
DARPA Releases Request for Industry Assistance in Developing New Cooling Techniques
The U.S. Defense Advanced Research Projects Agency (DARPA) has released a formal request to industry for assistance in the development of new electronics cooling techniques for use in military embedded systems and radio frequency monolithic microwave integrated circuit (MMIC) power amplifiers. The request comes as part of the Intrachip/Interchip Enhanced Cooling (ICECool) … [Read more...]
Adaptable Concurrent CFD Simulation Software Provides Ease-of-Use
Mentor Graphics Corporation has announced the newest version of the FloEFD concurrent computational fluid dynamics (CFD) simulation software. According to the company, the new software version provides a “significant workflow process improvement, including automated geometry clean-up … [and] the ability to mesh complex models.” The software also includes parametric “study and … [Read more...]
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