Researchers at Lehigh and Johns Hopkins Universities have achieved the best ratio to date between opposing types of light-scattering phenomena that occur in semiconducting materials. Yujie Ding, professor of electrical and computer engineering at Lehigh University, suggests that the discovery could lead to smaller, lighter and cheaper communication devices with faster switching … [Read more...]
Advances in Materials and Adhesives for LED Thermal Management Webinar
Fabrico, a designer in flexible materials converting and advanced assembly capabilities, and 3M, a supplier of adhesives and materials, have co-authored a webinar on advances in materials and adhesives for thermal management in LEDs and LED light fixtures. The on-demand webinar discuses thermal interface materials (TIMs), how to select the right TIM for an application, … [Read more...]
LED Liquid Silicone Cooling Technology Receives New Name
Full service verbal design agency Zenmark recently assisted SWITCH Lighting with the development of a name for their new LED cooling technology. Newly-named LQD Cooling System, SWITCH Lighting’s patented LED cooling technology utilizes a coolant made of liquid silicone and a highly efficient piston that deals with internal pressure. The two components work in sync to cool the … [Read more...]
Recording of Live Webinar – Advanced Thermal Management Materials and Applications
In response to the serious deficiencies of traditional thermal materials, new advanced materials are continually being developed, a number of which have thermal conductivities up to 1700 W/m-K with low densities and low coefficients of thermal expansion (CTEs): What are the payoffs? Do the advantages outweigh the disadvantages? How are these new advanced materials … [Read more...]
Thermally Conductive Epoxy System for Bonding Heat Sinks in Electronic Assemblies
Aremco Products, Inc., a developer of technical ceramics, adhesives, coatings and sealants, has released Aremco-Bond™ 860, a thermally conductive epoxy system developed for bonding heat sinks and fins used in heat exchangers and electronic assemblies. Aremco-Bond™ 860 is comprised of a ratio of one-part base resin to one-part activator by weight and can be used for … [Read more...]
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