Air Innovations’ ability to address demanding specifications was recently showcased when a global supplier to the semiconductor and photomask-making industries outlined the need for an environmental control unit that could service any of its nanomachining mask repair tool systems on demand. Sophisticated and intricate masks are used in the manufacture of all integrated … [Read more...]
New Socket Addresses High Performance Requirements
Ironwood Electronics has introduced a new MicroSD socket, SBT-MicroSD-01, addressing high performance requirements for Speed Class Rating, which guarantees a minimum rate at which data can be written to the card. The contactor is a stamped spring pin with 19 gram actuation force per pin and cycle life of 500,000 insertions. Low force eliminates pin sticking issues from … [Read more...]
High Efficiency Thermoelectric Air Conditioners
TECA Corporation has introduced the AHP-4250 family of thermoelectric air conditioners. They have a cooling capacity of 3,600 BTU/HR. “Green Zone” styles have efficiencies approaching 100 percent. Both styles come standard with TECA’s eco-mode temperature control design which helps save energy by limiting the need for active cooling when it’s not needed. Like TECA’s other … [Read more...]
Broader Adoption of Vapor Chamber Technology
Cooler Master has announced the broader adoption of Vapor Chamber Technology developed by Cooler Master's OEM and industrial cooling division in its retail Heatsinks. Cooler Master is expanding the TPC series and will equip selected Models of the V series with Horizontal Vapor Chambers. Horizontal Vapor Chambers spread heat eight times faster than solid copper, eliminating hot … [Read more...]
New Heatsink Supports More Package Sizes
Ohmite Manufacturing Company, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has introduced the Ohmite C Series heatsink which now supports most resistor package sizes from TO-126 to TO-264. Ideal for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, the heat sink … [Read more...]
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