A group of Harvard scientists were able to create quantum bits, or qubits, and store information in them for nearly two seconds – all at room temperature. Previous work with qubits required they be cooled to near absolute zero, but the Harvard scientists used diamonds that increased the life span of previous systems by six times. This research is an important step in research … [Read more...]
Research Progresses LEDs Made out of Silicon
A recent theoretical study by a University of Waterloo doctoral candidate in nanotechnology engineering suggests that manufacturers may one day make lasers and LEDs out of silicon, a cheaper material with greater thermal conductivity. Silicon is not currently used in LEDs or lasers because of its indirect bandgap, which hinders light emission. The new research suggests, … [Read more...]
Recruitment Agency Offers Tips for Young Engineers
Young engineers can improve prospects by becoming professionally registered, advises recruitment specialist As the employment market for graduate engineers with limited experience becomes increasingly competitive, young engineering candidates need to offer more than a degree to ensure a successful application. According to Jonathan Lee Recruitment, an engineer who is … [Read more...]
New QFN socket addresses high performance requirements for 0.5mm pitch devices
Ironwood Electronics recently introduced a new QFN socket addressing high performance requirements for 0.5mm pitch devices - SBT-QFN-4016. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 15.7 GHz and capacitance 0.097pF. The current … [Read more...]
Flip Chip Micron Scale Thermal Mapping Solution
Microsanj has introduced flip chip micron scale thermal mapping solution, a new high performance product in the Thermoreflectance Nanotherm Series. The NT220A, featured at the IPFA-2012 Conference in Singapore, adds near-infrared capability to support through-the-substrate thermal imaging. This feature enables accurate high resolution thermal mapping and analysis of flip-chip … [Read more...]
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