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Electronics Cooling

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Microblower Based on Piezoelectric Technology

 

  Murata Americas announced the launch of a microblower that uses a piezoelectric diaphragm, which vibrates up and down when a sine wave voltage is applied. The vibrations force air into the microblower and out through a nozzle on the top of the device. Used as an air pump and capable of creating a high air pressure flow, the pump is ideally suited to shorten the duration … [Read more...]

Improved Thermal Management in Power Semiconductors with LL Packages

 

  StratEdge Corporation, high-performance semiconductor package maker for microwave, millimeter-wave, and high-speed digital devices, launched the LL family of high-power laminate packages. The LL leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and … [Read more...]

Liquid Dispensed Thermal Interface Material Filler

 

The Bergquist Company introduced Gap Filler 1000SR, a two-component, room temperature cure, liquid-dispensable thermal interface material that features slump resistance. As dispensed, the material is designed to remain in place and maintain its shape on the target surface, allowing for flexibility in component orientation during assembly. As cured, the soft elastomer provides a … [Read more...]

Thermal Testing Standards for LEDs

 

JEDEC Solid State Technology Association has announced the publication of a new series of standards for component level testing of high-brightness/power LEDs. The new JESD51-5x series of standards is aimed at thermal characterization of power LED components. The standards include clear recommendations for which data to include on LED data sheets, as well as test environments … [Read more...]

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