While investigating iron-based HTS, researchers from Kyoto University and the Japan Synchrotron Radiation Research Institute found that its electronic properties were different in the horizontal and vertical directions and provide the strongest evidence yet of electronic nematicity in HTS. The study used the parent compound barium iron arsenide and measured electronic … [Read more...]
Hot-Water Cooled Supercomputer
The first commercially available computer system that is cooled with hot water rather than air was unveiled at the Leibniz Supercomputer Centre in Munich. The IBM iDataplex system removes heat 4,000 times more efficiently than air-cooled systems using a new form of IBM’s hot-water cooling technology. It cools active components in the system such as processors and memory modules … [Read more...]
Electronics Cooling June Issue Now Online
Don’t miss out on the June 2012 issue of Electronics Cooling, which includes feature articles on hot spot dissipation, spray cooling , metal foam-PCM heat storage technology, and much more. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read the June 2012 issue here. Download your copy of the June 2012 issue here. … [Read more...]
Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performance
Thermal design and material selection continues to be a concern for electronic packages, particularly for flip chip ball grid array packages (FCBGA). Lower cost package options are available today, which are finding applications in high power design spaces that previously only employed copper lid heat spreaders. Exposed die flip chip packages are used frequently in lower power … [Read more...]
Spray Cooling Heat Transfer – Test and CFD Analysis
Spray cooling processes yield high heat transfer coefficients due to heat absorption associated with latent heat absorption during liquid-vapor phase transition [1-5]. Spray cooling advantages lie in potentially eliminating TIM1 and TIM 2 thermal resistances, yielding significant reduction in overall thermal resistance. Due to the complexity and chaotic nature of millions of … [Read more...]
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