Forced convention air cooled heat sinks and liquid cooled cold plates are quite pervasive in their use in electronics cooling applications. While there can be significant debate on whether to air or liquid cool a particular component, the approach a thermal engineer would adopt to design both components is essentially similar. Parallel plate fins are the most common geometry … [Read more...]
Metal Foam-PCM: Heat Storage Technology: The Thermal Charging Scenario
For optimal operation of electronics, the generated heat must be removed and hot spots must be mitigated. If the junction temperature increases above a specified limit, some electronic components may fail, or experience a decline in performance. Excess temperature also causes thermal stresses that lead to fracture of electronic packages. Phase change materials (PCMs) are … [Read more...]
Time Dependant Responses and Superposition
One of the “fairy tales” that I see as a trend in thermal engineers performing electronics cooling is that they become dependent on the capabilities and methodology of the particular software they use. If the help guide or our mentor showed us how to solve a particular problem with our software tool and it worked, we may not have a reason to change even if the method is not the … [Read more...]
Editorial: My Personal Thermal Management Project
It can be an amusing thing to notice how sometimes things come full-circle in our lives. My involvement with heat transfer began in college and continued through grad school and a post doc, as I conducted experiments involving liquid helium, both as a refrigerant and the object of study. Since liquid helium was such a precious refrigerant, a key strategy for achieving these … [Read more...]
Modeling and Experimentation: Characterization of Hot Spot Dissipation in 3D Stacks
Three dimensional (3D) integration is considered a very promising technology for integrated circuit design [1]. It offers numerous opportunities to designers looking for more cost-effective system chip solutions. It allows further decrease in the form factor of today's systems and eases the interconnect performance limitation since the components are integrated on top of each … [Read more...]
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