Two new studies performed at the U.S. Department of Energy’s Argonne National Laboratory have revealed a new pathway for materials scientists to use previously unexplored properties of nanocrystalline-diamond thin films. The unusually attractive thermal properties of diamond thin films have led scientists to suggest using this material as a heat sink that could be integrated … [Read more...]
Slim Form Factor Liquid Cooling for Laptops and All-In-Ones
Asetek Inc. announced today a new slim form factor liquid cooling technology for extreme performance and workstation grade laptops and All-In-One PCs. The fundamental challenge in cooling desktop replacement laptops and All-In-One PCs is the lack of space for a proper thermal solution. Consequently, previous attempts at liquid cooling laptops have offered no performance … [Read more...]
Company Demonstrates Thermal Cooling Jet Technology
GE Global Research presented its advanced, dual piezoelectric, thermal cooling jet (DCJ) during a vendor workshop at SEMI-THERM 28. The DCJ, a 1 mm thick, ultra-compact bellows device provides air flow more efficiently than a traditional cooling fan and in less space. Its thin form factor allows for more design flexibility in electronics applications, such as tablets, where … [Read more...]
Interview with SEMI-THERM Founder, Bernie Siegal
Bernie Siegal, the founder of SEMI-THERM, gives a snapshot of the history of the symposium, the current event and the future of SEMI-THERM. … [Read more...]
David Copeland Welcomes You to "The Heat is On" by MEPTEC
Conference chair speaks about "The Heat is On," a mini-conference of SEMI-THERM 28, which deals in the thermal management and packaging of electronic products and devices. The theme was evolutionary and revolutionary trends in the field. … [Read more...]
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