SINCE 2008, collaborative research conducted at Raytheon Company, Thermacore Incorporated, Purdue University and Georgia Tech Research Institute has pursued the development of Thermal Ground Plane (TGP) technology. The DARPA-sponsored Radio Frequency Thermal Ground Plane (RFTGP) program focused on the development of high effective conductivity (keff >1000W/mK), low … [Read more...]
Calculation Corner: Transient Modeling of a High Power IC Package, Part 2
Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a high-power IC package attached to a heat sink. These include the finite element analysis (FEA) method and a numerical model, which represents the package and heat sink … [Read more...]
Ionic Winds: A New Frontier for Air Cooling
AIR-COOLING IS THE oldest and, in many ways, the easiest method of cooling electronics, whether it be through fan-driven forced convection or simply natural convection. However, with the increasing speed of processors, shrinking of form factors, and expansion of device functionality, air-cooling has begun to find itself on the outside looking in as new cooling technologies are … [Read more...]
Thermal Facts & Fairy Tales: Heat Spreading Revisited
AS PROMISED IN MY editorial of the 2011 Fall issue, I will devote this issue’s column on the topic of heat spreading. The reason is that I, while writing a white paper on basic thermal management for LED applications, found some unexpected facts pointing at problems of interpretation of heat spreading data for dual layers when using the often-used heat spreading equations. In … [Read more...]
Editorial: Forward Looking
IN THE LAST WINTER ISSUE OF ELECTRONICS COOLING, our friend and colleague Bob Simons used his editorial column to inform us that he was resigning his position as an associate technical editor and this issue will be his last. The title of Bob’s editorial was “Looking Back” so it seems fitting to include the term forward in the title of this editorial and to use this space to … [Read more...]
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