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Electronics Cooling

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Editorial: Looking Back

 

In the editorial in the fall issue of ElectronicsCooling, my good friend and colleague Clemens Lasance wrote, “It is the privilege of an editor to discuss any subject that comes to mind, as long as it is (remotely) linked to the theme of the journal.” So, as the editor responsible for this issue of the magazine, I want to avail myself of this privilege. As I contemplate what I … [Read more...]

Thermal Facts and Fairy Tales: Heat Sinks, Heat Exchangers and History

 

As far as history goes, the field of electronics cooling does not have a very long past. A rather quick look through my personal reference material that is strictly geared towards cooling electronics had at the earliest some US Navy documents from the 1950s [1]. Comparing the solution techniques available today to those available then shows that we have both much better tools … [Read more...]

New Capacitors with Low Insertion Height

 

TDK-EPC has developed a wide range of EPCOS MKP and MKT film capacitors with low insertion heights. The new capacitors with a lead spacing of 37.5 mm feature insertion heights of only 15 or 19 mm. These components are designed for rated voltages of between 63 and 2000 V DC or 250 to 400 V AC.  Their capacitance ranges from 0.1 to 82 µF.  Depending on type and technology (MKT or … [Read more...]

Precision High Voltage Modules

 

Spellman High Voltage Electronics Corporation’s new V6 high precision, cost-effective high voltage modules on a common platform include either AC or DC input, with analog or digital interface (RS232) capabilities. The V6 Series offers output voltages ranging from 500V to 30kV, and incorporates the high precision features of Spellman’s 600 Series (replacing the 602C, 603C, 605C … [Read more...]

Technical Brief: Design Considerations for High Performance Processor Liquid Cooled Cold Plates

 

The meteoric rise in cooling requirements of commercial computer products has been driven by an exponential increase in microprocessor performance over the last decade. The conventional way to cool microprocessors has been to utilize air to carry the heat away from the chip, and reject it to the ambient. Air cooled heat sinks are the most commonly used air-cooling devices with … [Read more...]

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