The previous article in this series on thermocouples described how the size of the thermocouple wire could affect its accuracy [1]. This is particularly true if the wire is exposed to high convection coefficients. This article addresses a separate issue, namely the degree to which the attachment method impacts thermocouple readings. As it turns out, once again the … [Read more...]
Thermal Analysis Methodology Best Practices
Thermal analysis: It’s a field that every mechanical engineer is exposed to during their undergraduate studies and many dabble in at some point during their professional careers. It’s also a field that some devote their full-time careers to as dedicated thermal engineers (or thermal analysts). Regardless of where in the broad spectrum of mechanical engineering work scope you … [Read more...]
Design Considerations for Chip/Package Level Bare Die Impingement Cooling for High Performance Computation Systems
Introduction of Bare-Die Jet Cooling in Package With the rising demand for more powerful, efficient, high-performance computation (HPC) systems, power densities of devices have increased dramatically. To cope with the increasing heat flux challenge for future data center servers beyond 1 kW/cm2, efficient liquid cooling solutions are needed to address those thermal … [Read more...]
Inventec Thermasolv™ Fluorinated Fluids vs. Hydrocarbons for Immersion Cooling
At the Thermal Live Spring Summit 2024 hosted by Electronics Cooling, discussions revolved around groundbreaking developments in thermal cooling technologies. Here is a detailed summary of key takeaways from Inventec's presentation: 1. Industry-specific Development — ThermoSolv Fluorinated Fluids vs. Hydrocarbons: The session kicked off with an in-depth exploration of the … [Read more...]
How Many Ways Can Temperature Affect Performance and Reliability of Electronic Systems?
Thermal management in high performance electronics has become a leading challenge for design and reliability engineers. Harsh temperatures can be caused either by harsh operational conditions (high power dissipation), or by harsh environmental conditions. Both require adequate thermal management to ensure that the product temperature stays within acceptable limits. High … [Read more...]
- « Previous Page
- 1
- 2
- 3
- 4
- 5
- …
- 481
- Next Page »
