The current millennium has been marked by great change in so many areas — political, economic, cultural, technological, climatic ... and the list goes on. I, as I’m sure many of you, often look for things that persist in a familiar form despite the flux of events that surround us. We often can count on our personal relationships within families, friends, and communities to help … [Read more...]

Simulation of temperature fields in electronics is a frequent task for thermal design engineers. Depending on the need and available time, the simulation used to predict temperatures may range from hand calculations to full physics-based numerical simulations. Accurate thermal simulations are always desired but in most instances, even assessing the accuracy level within a … [Read more...]

For almost 10 years now, the increasing heat loads in data centers have been recognized as a growing problem [1]. One of the approaches that has been effective in attacking this problem is the introduction of a water-cooled heat exchanger at the rear of a rack [2-5]. Using this approach, a part or nearly all the heat load absorbed by air passing over the heat dissipating … [Read more...]

Expansion-matching materials development for semiconductor packaging has traditionally focused on ceramic, organic, metallic and composite materials used for packaging of silicon die for a broad variety of applications in many types of equipment markets. Market segments where these types of materials are used include integrated circuits, RF devices and components for … [Read more...]