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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Talk Tackles Challenges of LED Test Standards

 

Defining thermal resistance for LEDs is important as some LED vendors neglect the effect of radiant flux in their calculations, which results in better data than is actually achieved in the field, noted Mentor Graphics’ András Poppe, PhD, in a recent presentation at MEPTEC’s The Heat is On event. Still another example where calculations need to be carefully weighed is … [Read more...]

iMAPS NEW ENGLAND 38th Symposium & Expo

 

May 3, Boxborough, Mass. •         New for 2011 “Big Red’s Marketplace” An Incubator Area of Table Top Spaces for FIRST TIME EXHIBITORS •         Plus Our Fully Carpeted Exhibit Hall with Sixty 8’x10’ Booths - Click for Exhibitor Registration •         38th Annual Symposium - "Greatest Symposium & Expo on Earth" Theme •         Expanded Technical Program: 8 Sessions … [Read more...]

Connector/Decoupler Integrated in a Heat Sink

 

United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from each other and function as radiators that dissipate heat from the stacked semiconductor chips. Conductive wiring structures are formed on each set of … [Read more...]

New Thermal Testing Standard

 

JEDEC has approved a thermal transient testing-based measurement methodology inspired by an original idea published jointly by Mentor Graphics Corporation’s MicReD® group and the Automotive Power Application group of Infineon in 2005. This newly published JESD51-14 standard is titled “Transient Dual Interface Test Method for the Measurement of the Thermal Resistance … [Read more...]

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