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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Low Resistance, Zero Pump-Out Thermal Pad

 

AOS Thermal Compounds’ Microfaze 3 A-4 is a non-silicone thermal pad that exhibits low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease.  The pad is composed of 1 mil films of high thermal conductivity, tacky, but dry-to-the-touch thermal grease on either side of a 2 mil aluminum foil substrate. Learn more from AOS … [Read more...]

30 GHz Leadless Chip Carrier Packaging Platform

 

Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for supporting demands for broadband (DC to 30 GHz), low pin-count ASIC … [Read more...]

Cold Plates for Demanding Military Cooling Applications

 

Thermacore introduces a new line of cold plates that meet the most recent VME64x/VPX standards and supports commercial off-the-shelf packaging formats. With the thermal performance and flexibility these cold plates offer, military embedded system designers can reduce system size, weight, and power with improved cooling, permitting better mobility and extended mission … [Read more...]

Breakthrough Thermal Material System to Enable Faster Computing

 

Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices, such as a laptop, twice as well as copper. The development of GE’s prototype substrate, which utilizes phase-change-based heat … [Read more...]

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