Controlling the temperature in a data center is critical to achieving maximum uptime and efficiency, but is it being controlled in the correct place? Whilst data center layouts have moved swiftly towards the segregation of hot and cold air, with hot aisle/cold aisle designs being industry standard, typical air handler temperature control strategies are still rooted in the … [Read more...]
LED Lighting Modules for High Heat Applications
Electronic components distributor Digi-Key Corporation recently announced its stock of Cree’s LMR4 LED light modules is available in Europe and around the world. Cree LED Module LMR4 integrates driver electronics, optics, and primary thermal management, making the compact module drop-in ready. Designed to last 35,000 hours while consuming just 12 watts of power, it delivers 700 … [Read more...]
Graphics Card with Thermal Design Offers Quiet Performance
Graphics card and mainboard manufacturer MSI recently unveiled its N560GTX-Ti Twin Frozr II/OC graphics card featuring the Twin Frozr II Thermal Design. An appraisal by BenchmarkReviews.com determined that “the Twin Frozr II cooling system is a well proven package that kept the GF104 GPU quite cool, even during stress testing.” The thermal interface material (TIM) was very … [Read more...]
Structural Adhesive Cures at Room Temperature
Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. … [Read more...]
Thermal Company Partners With Packaging Services Firm
Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS resources provides thermal measurement and modeling capability for IC, diode, transistor, LED, and PV devices and related packaging alternatives. … [Read more...]
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