Sponsor

Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Sponsor

Beer Fridge – A Case Study in Thermal Design. Part 2 – TEC Effect

 

Beer drinkers are notoriously quiet people and as such would not want to be disturbed by the continuous hissing and whirring of a classic compression/expansion refrigeration cycle type beer fridge. They would argue that’s why both kids and kitchens were invented. Kitchens to put the noisy fridge in, kids to go get the next beer. Electric coolers, fridges that utilise … [Read more...]

Taking the Enterprise Data Center into the Cloud: Achieving a Flexible, High-Availability Cloud Computing Infrastructure

 

This white paper provides a detailed overview of cloud computing technology, including a standard definition of cloud computing, common types of cloud architectures and services, and driving factors and perceived risks impacting widespread adoption. It also examines best practices for optimizing critical systems for the deployment of cloud architectures in existing facilities, … [Read more...]

Lowest Resistance, Zero Pump-Out Thermal Pad

 

AOS Thermal Compound’s Micro-Faze® 3 A-4 is a non-silicone thermal pad that exhibits extremely low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease. The pad is composed of 1 mil films of high thermal conductivity, tacky, but dry-to-the-touch thermal grease on either side of a 2 mil aluminum foil substrate. The … [Read more...]

TECs for Larger Heat Pumping Applications

 

Nextreme Thermal Solutions recently introduced the eTEC HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements. At 85°C, the eTEC 0.6mm-high HV56 can pump 6 watts or 58 W/cm2 of heat in footprint of only 11 mm2. At 85°C, the eTEC HV56 can … [Read more...]

New Small Form Factor Conduction Cooled Chassis

 

Curtiss-Wright Controls Electronic Systems has introduced a new, rugged 6-slot 3U OpenVPX (or 7-slot 3U CompactPCI) conduction cooled chassis for harsh military environments. The SFF-6 Small Form Factor Chassis is the newest member of Electronic Systems’ Hybricon® family of advanced military COTS electronic packaging solutions and features the company’s CoolWall™ thermal … [Read more...]

Industry Sponsors

Sponsor
Sponsor