Socket your LGA297 using Extreme Temperature Socket with Superior Electrical Performance January, 2021 Ironwood Electronics recently introduced a new LGA socket addressing high-performance requirements for 0.5mm pitch LGA297 – CBT-LGA-5029. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 125,000 insertions. The self-inductance … [Read more...]
Case Study: Numerical Prediction for Thermal Management of Battery Packs with Cloud-based CFD
Electronics are becoming smaller and smaller and the requirement to dissipate heat is constantly growing. The lack of an efficient thermal management strategy can lead to low performance, energy inefficiency, system failure, and even serious damage. With numerical simulation, such strategies can be tested early in the design process. This article shows how to use this … [Read more...]
High-Capacity Thermoelectric Coolers from Laird Thermal Systems Maximize Laser Projector Performance
The new UltraTEC™ UTX Series of thermoelectric coolers maintains temperature stability in applications such as laser projectors that require high heat pumping capability… November, 2020 – Outdoor light shows and cinemas utilize laser projection technology to deliver high-quality images with sharp contrasts, exceptional brightness and a wide color range. Because heat load in … [Read more...]
CoolIT Systems Continued Leadership in Advanced Data Center Cooling Showcased at SC20
CoolIT launches several new products to further support data center leaders Calgary, Alberta. November 18th, 2020 – CoolIT Systems, the global leader in scalable direct liquid cooling technology (DLC) for desktop and data center systems, announces multiple new product developments and launches at Supercomputing 2020. As the leading liquid cooling integration partner for … [Read more...]
Precision-Clad Composite Materials for Heat Spreaders in Handheld Electronics
The selection of heat-spreader materials is an important consideration for cooling modules in handheld electronic systems. Heat spreaders are typically used in close contact with the source of heat. This can be, for example, a subcomponent, chip, or microelectronic package. The heat spreader transfers and distributes heat from the source to a heat sink through a thermal … [Read more...]
- « Previous Page
- 1
- …
- 35
- 36
- 37
- 38
- 39
- …
- 482
- Next Page »
